Multivac spotlights new technologies at Pack Expo 2010
Leading manufacturer of thermoform fill-seal rollstock packaging solutions, vacuum chamber systems, traysealers to showcase latest technologies at tradeshow.
Multivac, Inc. of Kansas City, MO, has plans to take the stage at this fall’s Pack Expo 2010 convention with a wide variety of packaging machinery engineered for businesses of every size.
At booth #E6242 at the McCormick Place Convention Center in Chicago, Illinois, Oct. 31 – Nov. 3, the company will also unveil its first-ever thermoformer built on an Allen-Bradley control platform manufactured by Rockwell Automation.
“Multivac’s open-architecture IPC machine controls enable our packaging systems to be seamlessly integrated into any machine environment,” says Jan Erik Kuhlmann, Multivac’s president and chief executive officer. “However, we realize the importance of complete flexibility for those customers already working with an installed base of equipment running Allen-Bradley controls, and Multivac is pleased to offer this alternative as well. We look forward to showcasing it along with multiple offerings at this year’s Pack Expo convention.”
Also included in Multivac’s line-up are a high-speed R245 thermoformer equipped with robotic product handling, Multivac Vision System (MVS) and labeling. The R105, Multivac’s smallest and most economical thermoformer, will be on display along with a variety of tray sealers and vacuum chamber packaging systems designed for businesses and volume requirements of every size.
Pack Expo 2010 will also mark the U.S. exhibition debut of the new B610 (see photo above) belted vacuum chamber packaging system, the largest and highest-capacity machine of its kind available in North America. With its patented tilting lid, the B610 offers a host of state-of-the-art features for superior performance, easy maintenance, cost savings and energy conservation.