Harpak-ULMA announces new partnership at PACK EXPO
Harpak-ULMA is currently in Chicago for PACK EXPO International.
October 15, 2018
Harpak-ULMA president Kevin Roach addressed a large crowd at their coveted booth on the subject of smart connected technologies in Chicago for PACK EXPO International 2018.
In the same address, Roach also unveiled a new partnership with leading automation leader Rockwell Automation, Allen-Bradley.