Event at PACK EXPO promotes “Ingenuity for Life”.
Finally… spring is here, and the PAC Packaging Consortium is holding its 67th Annual Spring Golf Tournament on June 12, 2018.
Donation also includes licenses for 75 concurrent users.
Retailers challenge the packaging industry to innovate solutions to reduce consumer reliance on single-use packages and bags at retail level.
Stratasys selects winners for the 2015 Extreme Redesign 3D Printing Challenge, with Ryerson University and Etobicoke Collegiate grabbing awards.
Discover what printed electronics means to the print and packaging industries in this free seminar featuring speakers from Xerox and Jones Packaging.
School receives packaging workflow software tools and CDI flexo plate imaging system assist course, extracurricular, and research activities.
Day event to demonstrate the power of Esko’s graphic software programs.