Canadian Packaging

Process Expo: Delkor puts best footprint forward

Latest addition to Capstone Closure line needs little floorspace.


October 25, 2011
by Canadian Packaging Staff

Delkor Systems, Inc., in booth #1426 of the PROCESS EXPO 11 held November 1-4, 2011 in Chicago’s McCormick Center, South Hall, is displaying its new TriSeal Carton Closer TSC-300z that needs less than 25-square-feet of floor space. Designed for low- to mid-range throughput, up to 60 cartons per minute, with precision closing for a variety of carton styles.
For more company information, visit www.delkorsystems.com.