Canadian Packaging

Free seminar on printed electronics

Discover what printed electronics means to the print and packaging industries in this free seminar featuring speakers from Xerox and Jones Packaging.


March 25, 2013
by Canadian Packaging Staff

Discover what printed electronics means to the print and packaging industries in this free seminar featuring speakers from Xerox Innovation Group and Jones Packaging.

Come to Ryerson University in Toronto on March 28, 2013 for an evening of networking and education.

Sponsored by PAC—The Packaging Association and Ryerson University, speakers will discuss the latest developments in printed electronics, how they will be incorporated into packaging workflows, and the marketing implications for the consumer packaging industry.

A catered reception will follow featuring interactive product demonstrations from Bash Interactive, Ryerson DMZ startup Flybits, and Graphic Monthly Canada.

Speakers are: Dr. Paul Smith, vice-president of the Xerox Innovation Group (XRCC) in Mississauga discussing the ‘Latest Developments in Printed Electronics‘; and James Lee, director of technology & innovation with Jones Packaging, speaking on ‘Printed Electronics for Consumer Packaging‘.

When:
Thursday, March 28th, 2013
6PM – 6:30PM –  Registration
6:30 PM – 7PM – Latest Developments in Printed Electronics, Paul Smith (Xerox XRCC)
7PM – 7:30PM – Printed Electronics for Consumer Packaging, James Lee (Jones Packaging)
7:30PM – 8PM – Panel Discussion / Q&A
8PM – 9PM – Catered reception / Interactive Demos

Where:
Ryerson University
George Vari Computing & Engineering Building
245 Church St, Toronto, ON, M5B 1Z4
Room ENG103

Price:
Free (dinner included) – but you have to pre-register.

How:
Click HERE to register online

Contact for more information:
Andrew Wong
Ryerson University
416-843-6168
E-mail: andrew2.wong@ryerson.ca

Lindsey Ogle
PAC – The Packaging Association
416-646-4641
E-mail: logle@pac.ca